Power chips are linked to exterior circuits via packaging, and their performance depends upon the assistance of the product packaging. In high-power circumstances, power chips are usually packaged as power modules. Chip interconnection refers to the electrical link on the upper surface of the chip, which is typically light weight aluminum bonding wire in standard components. ^
Traditional power component plan cross-section
Presently, industrial silicon carbide power modules still mostly use the product packaging modern technology of this wire-bonded typical silicon IGBT component. They encounter troubles such as huge high-frequency parasitic criteria, not enough warm dissipation capability, low-temperature resistance, and inadequate insulation toughness, which limit making use of silicon carbide semiconductors. The screen of exceptional efficiency. In order to solve these issues and completely exploit the big prospective benefits of silicon carbide chips, numerous new packaging innovations and services for silicon carbide power modules have actually emerged over the last few years.
Silicon carbide power module bonding approach
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding materials have actually created from gold cord bonding in 2001 to light weight aluminum cable (tape) bonding in 2006, copper cable bonding in 2011, and Cu Clip bonding in 2016. Low-power gadgets have created from gold cables to copper cords, and the driving pressure is expense decrease; high-power gadgets have actually created from aluminum wires (strips) to Cu Clips, and the driving force is to boost product efficiency. The higher the power, the higher the requirements.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a packaging process that uses a strong copper bridge soldered to solder to connect chips and pins. Compared to traditional bonding packaging approaches, Cu Clip technology has the following benefits:
1. The connection in between the chip and the pins is constructed from copper sheets, which, to a particular extent, changes the common wire bonding technique in between the chip and the pins. Consequently, a special bundle resistance value, greater current flow, and far better thermal conductivity can be gotten.
2. The lead pin welding area does not require to be silver-plated, which can fully save the expense of silver plating and poor silver plating.
3. The item appearance is totally consistent with normal products and is generally utilized in servers, mobile computers, batteries/drives, graphics cards, motors, power products, and other areas.
Cu Clip has two bonding methods.
All copper sheet bonding method
Both eviction pad and the Resource pad are clip-based. This bonding technique is a lot more expensive and intricate, but it can accomplish better Rdson and far better thermal impacts.
( copper strip)
Copper sheet plus wire bonding method
The resource pad makes use of a Clip approach, and eviction uses a Wire method. This bonding technique is slightly less costly than the all-copper bonding technique, saving wafer location (appropriate to extremely tiny gate areas). The procedure is easier than the all-copper bonding approach and can acquire much better Rdson and far better thermal impact.
Vendor of Copper Strip
TRUNNANOÂ is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding copper kg price, please feel free to contact us and send an inquiry.
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